Chip Quik SMD4300LTLFP250T4, Solder Paste in Jar, 250g (T4) Sn42/Bi57.6/Ag0.4, Low Temp Water-Washable No-Clean

Solder Paste in jar 250g (T4) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F Water-Washable No-Clean.

Specifications
Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic Water-Washable No-Clean
Flux Classification: REL0
Metal Content: 90% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 138C (281F)
Size: 250g jar

Shelf Life
Refrigerated >6 months, unrefrigerated >2 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Technical Data Sheet

Safety Data Sheet