Chip Quik SMD291AX250T3, Solder Paste in Jar, 250g (T3) Sn63/Pb37, No Clean

WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to: www.P65Warnings.ca.gov

Solder Paste in jar 250g (T3) Sn63/Pb37 no clean 90.25% metal.

Specifications
Alloy: Sn63/Pb37
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 90.25% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 183C (361F)
Size: 250g jar

Shelf Life
Refrigerated >12 months, unrefrigerated >6 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Technical Data Sheet

Safety Data Sheet