Indium 8.9HF - SAC305 Lead-Free No-Clean Solder Paste 600g

Premium lead-free solder paste for high-reliability SMT assembly. Indium 8.9HF is a halogen-free, no-clean solder paste formulated with SAC305 alloy for RoHS-compliant electronics manufacturing. This Type 4 powder solder paste delivers exceptional print definition, tack time, and solder joint reliability for fine-pitch components, BGA, and CSP applications.

PRODUCT SPECIFICATIONS
• SKU: PASTEOT-800495-600G
• Alloy: SAC305 (96.5Sn/3.0Ag/0.5Cu) - Lead-Free
• Powder Size: Type 4 (20-38 micron)
• Flux Type: No-Clean, Halogen-Free
• Package Size: 600 gram cartridge
• Shelf Life: 6 months refrigerated (2-10°C)
• Manufacturer: Indium Corporation

KEY FEATURES & BENEFITS
✓ Halogen-Free No-Clean Flux - Minimal post-reflow residue
✓ Excellent Print Definition - Type 4 powder for fine-pitch components
✓ Extended Tack Time - Maintains component placement stability
✓ Superior Wetting - Consistent solder joint formation
✓ Low Voiding - <5% voiding on BGA and QFN packages
✓ RoHS & REACH Compliant - Meets environmental regulations
✓ Wide Process Window - Forgiving reflow profile tolerance

IDEAL APPLICATIONS
• Surface mount technology (SMT) assembly
• Fine-pitch components (0201, 0402, 0603)
• Ball grid array (BGA) packages
• Chip-scale packages (CSP)
• High-reliability electronics (automotive, medical, aerospace)
• Consumer electronics manufacturing

SAC305 ALLOY COMPOSITION
• Tin (Sn): 96.5%
• Silver (Ag): 3.0%
• Copper (Cu): 0.5%

SAC305 is the industry-standard lead-free alloy, offering excellent mechanical strength, thermal cycling reliability, and compatibility with all common PCB surface finishes.

COMPLIANCE & CERTIFICATIONS
✓ RoHS Compliant - Restriction of Hazardous Substances
✓ REACH Compliant - European chemicals regulation
✓ Halogen-Free - <900ppm Cl, <900ppm Br
✓ J-STD-004 & J-STD-005 Tested - IPC industry standards